Benedikt Kainzbauer

Benedikt Kainzbauer is a final-year microelectronics MSc student at Delft University of Technology, currently completing his thesis at the Electronic Components, Technology and Materials (ECTM) group. He is investigating microfluidic defect formation by visualizing real-time capillary underfill dynamics in flip-chip arrays using a sacrificial photoresist casting method.

Prior to his MSc, he completed an internship as a Chip Machining Engineer at TRUMPF Lasersystems, where he engineered predictive early warning systems and automated data pipelines for ASML EUV scanner lasers. He holds a B.Sc. in Business Engineering and Electrical Engineering from the Technical University of Darmstadt, Germany. His broader interest lies in applying data-driven approaches, including physics-informed neural networks, to enhance microelectronics fabrication, reliability, and advanced semiconductor packaging.

Program: MSc Microelectronics